Honor has announced that the Honor Magic 3 series phones will be launched globally on August 12.
Today, Honor launched an advertisement on CCTV5 in China, announcing that it has become the official smartphone and terminal device supplier for the Chinese national team. The advertisement also unveiled the front appearance of the Honor Magic 3 for the first time.
As shown in the video, the front of the Honor Magic 3 features a waterfall display with dual punch holes in the upper left corner and well-controlled top and bottom bezels. This design also closely matches the previously leaked engineering photos of the Honor Magic 3. It is clear that the Honor Magic 3 basically continues the 80° ultra-curved waterfall screen of the Honor V40 series.
In addition, spy photos of the engineering prototype show that the phone’s chipset is the SM8350 (codename for Snapdragon 888). Based on official information, the Magic 3 should be powered by the Snapdragon 888 Plus chipset.
It is reported that compared with the Snapdragon 888, the Snapdragon 888 Plus integrates the Qualcomm Kryo 680 core, with a frequency of up to 3.0GHz, while the sixth-generation Qualcomm AI Engine achieves a computing power of 32 trillion operations per second (32 TOPS), with AI performance improved by more than 20%.
It is worth mentioning that some bloggers have reported that the Magic 3 Pro will feature an under-screen camera and a 2772 x 1344 resolution display. Thanks to this, the device not only has a more aesthetically pleasing full-screen design but also delivers better image quality.
According to 3C certification, the Magic 3 supports 66W wired fast charging, while the Magic 3 Pro supports 100W wired fast charging and 50W wireless fast charging.
