Xiaomi released the Xiaomi Mi 11 phone yesterday. To further explore its internal structure, Aiao Technology shared a teardown video on Bilibili today.
According to the teardown video, the internal components of the Xiaomi Mi 11 are neatly arranged and very aesthetically pleasing, showcasing the design and craftsmanship of this phone.
There are no other functional components on the back cover, only a large amount of cushioning foam. The main camera glass cover is processed by CNC, while the macro lens uses the cover glass directly, placing higher demands on the optical performance and flatness of the cover and making processing more difficult.
The rear camera of the Xiaomi Mi 11 uses Samsung’s HMX sensor S5K5E9 and OmniVision’s ultra-wide-angle CMOS OV13B10. The front camera is Samsung’s S5K3T2. This phone does not use Sony’s lenses.
The components on the motherboard are all covered with VC heat sinks, and copper foil, graphite, thermal paste, and aerogel are used to ensure the heat dissipation performance. The Snapdragon 888 SoC and flash memory are sealed with glue, which can further enhance their safety when the phone is dropped or exposed to water.
The Xiaomi Mi 11 comes with a BM4X lithium-polymer battery with a capacity of 4600mAh, manufactured by Sunwoda Electronics Co., Ltd.
The video creator also tested the phone’s thermal performance. After playing “PUBG Mobile” for 30 minutes at HDR high-definition 60Hz, the front of the phone reached a maximum temperature of about 41°C, while the back reached about 40°C. When playing “Genshin Impact” at the highest graphics settings for one hour, the maximum temperature reached 37°C. It seems that the Snapdragon 888 generates a lot of heat. If you remove all the cooling materials, such as copper foil and metal shielding, you would find that this SoC can easily reach temperatures above 80°C. It can be said that the Xiaomi Mi 11 performs very well in temperature control.
Currently, the Xiaomi Mi 11 is still on pre-sale and will go on sale on January 1, 2021. It is also the world’s first phone mass-produced with the Snapdragon 888.
Source: Bilibili
