Yesterday, Xiaomi officially released three mobile phones: Redmi Note 9 4G, Redmi Note 9 5G, and Redmi Note 9 Pro 5G. Today, the well-known repair company Aio Technology released the teardown video of these three phones.
According to the video, the back covers of Redmi Note 9 4G and Redmi Note 9 5G are made of plastic. The difference is that the back cover of Redmi Note 9 5G is treated to make it look like AG glass, while Redmi Note 9 Pro 5G uses real AG glass back cover.
The back cover of Redmi Note 9 4G has a heat dissipation film, while the heat dissipation film of the 5G and Pro 5G versions are covered on the fuselage. The back cover of the 4G and 5G versions has a fingerprint cable connected to the motherboard. Moreover, the back cover of them is also integrated with the antenna. The difference is that there are more antennas on the back cover of the 5G version.
The flash of Redmi Note 9 4G is integrated on the motherboard cover and connected to the motherboard through metal contacts. The flash of the 5G version is integrated on the roll cage of the camera module, and the flash of Pro 5G is welded to the motherboard.
The 3.5mm headphone jack of Note 9 4G is soldered directly on the motherboard, while the other two are integrated on the bottom board. The processors on the motherboard are covered with metal copper foil and coated with thermal grease. After tearing the copper foil, you can see the processor and ROM chip.
All three mobile phones use LCD screens, and the 4G version of the screen also integrates the main and sub-board cables.
Their screen models are PM6530MB2-3, PM6675JB3-1, PM6530JB3-4, all of them are from TCL China Star Optoelectronics Technology Co., Ltd.