Chinese manufacturers are doing a lot to improve the workability of gadgets such as smartphones and laptops. An important but salient aspect of a laptop is “heat dissipation”. For a laptop to work at full capacity, it must come with a proper heat dissipation system.
Recently, a user exposed the heat dissipation module of the Clevo X170 mold. Well, to say the least, the heat dissipation specifications is luxurious and state of the art. According to the image from the user, the Clevo X170 notebook mold has two built-in fans, each with 5 inter-connected heat pipes. With this geometry, there will adequate and uniform heat dissipation within and outside the device. This will permit optimal performance of the laptop.
According to recent speculations, the appearance of this mold was introduced in the previous video of LTT. The upcoming Clevo X170 comes with a 17.3-inch screen, X170SM-G, and also uses a mini-LED screen. The display is quite large thus it is not a device that you can carry at will. However, for top-notch display performance, this display brightness reaches 1000nit. In addition, the speaker system of the mold is also fully upgraded. It comes with 6 speakers. Of these speakers, 4 are full-range speakers while two are bass speakers. According to analysts, this will be the “loudest” notebook in history.
In addition, the user also revealed that this laptop will support MXM graphics cards from RTX 2060 to RTX 2080. In terms of heat dissipation, the CPU cooling capacity is expected to exceed 140W, the graphics card cooling capacity is expected to exceed 200W, and the integrated cooling capacity will reach 340W.
With such a heavy-duty cooling capacity, many will expect the laptop to be quite heavy. Unfortunately, we do not have the specifications of the weight of this device. Nevertheless, we all know that 17-inch notebooks are generally not devices we can carry around at will. Thus, it wouldn’t really matter if this device is heavy.