This morning, the iQOO V2339A appeared on the 3C certification website. According to sources, this phone is the iQOO Neo9 Pro and supports up to 120W charging.

As described in the certification, the device will use two chargers, V12060L0A0-CN and V12060L1A0-CN. However, they both support the same charging speeds. These chargers support 15W (5V/3A), 18W (9V/2A), 66W (11V/6A), and 120W (20V/6A) charging.

Apart from this, the 3C certification does not include any additional information. However, according to reports, the Neo9 series will include two devices: the Neo9 and Neo9 Pro.

The iQOO Neo9 will feature the Snapdragon 8 Gen 2 chipset. It has a Cortex-X3 super core, a Snapdragon X70 5G modem, and an Adreno 740 GPU. The iQOO Neo9 Pro will use the Dimensity 9300 chipset, featuring four Cortex-X4 super cores and four Cortex-A720 cores.

In addition, the iQOO Neo9 series is expected to feature an AMOLED display with 1.5K resolution, a 5000mAh battery, and a 50MP rear main camera.

Currently, there is no news regarding the release date of the iQOO Neo9 series. However, the 3C certification indicates that its release is not far off.

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This morning, the OPPO Reno11 and Reno11 Pro appeared on the China Telecom website, revealing their specifications and renders. It is worth mentioning that the Reno11 model number is PJH110, while the Reno11 Pro model number is PJJ110.

The OPPO Reno11 features a 6.7-inch display with a single punch-hole and Full HD+ resolution (2412 x 1080). The device is powered by the MediaTek Dimensity 8200 chipset, which is manufactured using a 4nm process and features four Cortex-A78 performance cores (one core clocked at 3.1 GHz, three cores at 3.0 GHz) and four Cortex-A55 efficiency cores.

This phone will feature a new camera layout with two vertically arranged circles. The first circle contains two camera lenses: a 50MP main lens and a 32MP lens, while the last circle contains an 8MP lens. It has a 32MP lens in the punch-hole.

This phone will be available in three storage versions: 8GB/256GB ($390), 12GB/256GB ($420), and 12GB/512GB ($445). The available colors are: Obsidian Black, Moonstone, and Fluorite Blue.

The OPPO Reno11 Pro features a 6.74-inch single-punch-hole display. This phone will be powered by the Snapdragon 8+ Gen 1 chipset, which is a more powerful and energy-efficient version of the Snapdragon 8 Gen 1.

Other aspects, including the rear camera design, lenses, and front camera, are all the same. However, this phone is available in two color options: 12GB/256GB and 12GB/512GB. The available colors for this device are Obsidian Black, Turquoise Green, and Moonstone.

The expected release date of the two phones is December 1, 2023. It is very likely that OPPO will announce the OPPO Reno11 series in the coming days.

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This morning, the Meizu M461Q was listed on the 3C certification website. According to sources, the device is the Meizu 21.

As stated in the certification, the Meizu 21 will use an 80W charger with the model number UP2040. In addition, this charger supports the following charging modes: 15W (5V/3A), 27W (9V/3A), 66W (11V/6A), and 80W (20V/4A). Besides this, the 3C certification does not contain any other information.

Compared with its predecessor, the Meizu 20 Pro is the only phone that supports 80W charging. Other devices, including the Meizu 20 and Meizu 20 Infinity, all support 67W charging.

According to previous reports, the Meizu 21 series will feature the Snapdragon 8 Gen 3 chipset. This chipset has a Cortex-X4 core clocked at 3.3 GHz, five Cortex-A720 performance cores clocked at 3.2 GHz, and two Cortex-A520 efficiency cores clocked at 2.3 GHz.

It will adopt a vertical camera layout and has an RGB ring LED flash. The camera setup will also include a 50MP main lens with OIS and a telephoto lens. This phone has a flat display with relatively thin bezels, similar to its predecessor.

The 3C certification indicates that the launch of the Meizu 21 series is not as far off as expected. It may be launched before the end of this year.

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This morning, MediaTek announced that it will hold a new product launch event at 7 PM on November 6 (China time). MediaTek also mentioned that this launch event will include the Dimensity 9300 chipset.

Regarding its specifications, the chipset is expected to offer significant improvements over its predecessor.

The Qualcomm Snapdragon 8 Gen 3 is expected to feature a Cortex-X4 super core. In contrast, the Dimensity 9300 chipset will feature 4 Cortex-X4 cores, suggesting a significant performance gap between the two chipsets.

The Dimensity 9300 will include one Cortex-X4 ultra core clocked at 3.25 GHz, three Cortex-X4 cores clocked at 2.85 GHz, and four Cortex-A720 cores clocked at 2.0 GHz.

Previously, the OPPO Find X7 with the Dimensity 9300 also surfaced on Geekbench 6. Its benchmark scores were significantly higher than those of its competitors.

For complete information regarding this chipset, we have to wait until November 6.

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This morning, Digital Chat Station revealed the specifications of the OnePlus Ace 3 prototype. As observed, its specifications have been upgraded compared to its predecessor. This phone is powered by the Snapdragon 8 Gen 2 chipset.

This chipset features a Cortex-X3 super core clocked at 3.2 GHz, a Snapdragon X70 5G modem, and an Adreno 740 clocked at 680 MHz.

In addition, the device still uses the Sony IMX709 as the telephoto lens and supports 2x zoom. It is worth mentioning that this lens is mainly used for selfies. The OnePlus Ace 3 features a metal mid-frame and a 5,500 mAh battery.

The charging speed is still limited to 100W, but it still seems to be a good match for a 5,500 mAh battery.

According to previous reports, this phone will feature a 6.74-inch OLED display with a single punch-hole and 1.5K resolution. This smartphone will also use the following lenses: a 50MP Sony IMX890, an 8MP OV08D10, and a Sony IMX709.

At present, there is very little information about the OnePlus Ace 3. However, it is expected to be launched as a rebranded version of the OnePlus 12R. In addition, the launch is expected to be very soon.

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This morning, Huawei announced on Weibo that the company will hold an autumn product launch event. The event will take place at 2:30 PM on September 25 (China time).

Huawei has not revealed which products are expected to be part of this launch event. However, it is very likely that Huawei will highlight previously launched phones at this event, including the Huawei Mate 60 series and Mate X5.

According to sources, Huawei has confirmed that it will launch new products at the event, including the FreeBuds Pro 3 and the Huawei GT 4 smartwatch. In addition, the Mate 60 RS ULTIMATE Design Edition will also be part of this launch event.

Huawei is also expected to introduce the new Kirin 9000S 5G chipset (for the Mate 60 series and Mate X5). According to current information, this chipset is manufactured using a 7nm process and consists of the following cores: one Cortex-A720 clocked at 2.62 GHz, three Cortex-A720 clocked at 2.15 GHz, and four Cortex-A510 clocked at 1.53 GHz.

In the coming days, Huawei may release a teaser for the products that will be launched at this event.

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This morning, Honor announced that the Honor V Purse will be launched on September 19 at 7:30 PM (Beijing time) in Shanghai. In the official announcement, the device’s appearance can be seen, which is very similar to the Mate Xs 2.

This smartphone features a foldable screen. When folded, the back screen features a rear camera setup with two lenses. In addition, there is a side-mounted fingerprint scanner

Honor previously stated that the thickness of the Honor V Purse is less than 9 mm, and the back screen (when folded) can display dynamic images. With the help of some portable accessories, it can be turned into a decorative handbag.

The specifications of this device have not been announced yet. However, according to the 3C certification, this phone will use a 35W charger.

The Honor V Purse will be powered by the Qualcomm Snapdragon 8 Gen 2. This chipset is manufactured using a 4nm process and features a Cortex-X3 super core clocked at 3.2 GHz, an Adreno 740 GPU, and a Snapdragon X70 5G modem.

At present, there is little information about this device. However, in the coming days, Honor may reveal its key highlights.

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This morning, iQOO announced on Weibo that the iQOO Z8 series will be launched at 7 PM on August 31 (China Time). In addition, iQOO also released a teaser video revealing its appearance, and the device’s chipset has also been announced.

As mentioned, the iQOO Z8 will be powered by the MediaTek Dimensity 8200 chipset. This chipset is manufactured using a 4nm process and features a Cortex-A78 core clocked at 3.1 GHz. It also integrates a Mali-G610 GPU and a 5G modem.

As shown in the teaser, this smartphone will feature a dual-camera system in a square camera module. The dual-camera setup includes a 64MP main lens (OIS supported) and a 2MP depth lens. The front has a 16MP selfie camera in the punch-hole.

The device features a 6.64-inch single punch-hole LCD screen with full HD+ resolution (2388 x 1080). The phone has a 5,000 mAh battery and supports 120W fast charging.

The specifications of the iQOO Z8x are not yet known. However, it is rumored to be powered by the Snapdragon 6 Gen 1 chipset, which is one of the best chipsets in the Snapdragon 6 series.

This chip is manufactured using a 4nm process and features four Cortex-A78 cores. The chipset integrates an Adreno 710 GPU and a Snapdragon X62 5G modem.

In the coming days, iQOO is expected to reveal more highlights of the iQOO Z8 series.

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This morning, Xiaomi announced on Weibo that the Mix Fold 3 will adopt a new hinge, making this phone both slim and lightweight. This innovation includes a three-segment linkage shaft, 14 movable joints, 198 independent shaft components, and a holeless floating plate design. These elements together create an excellent folding mechanism.

According to reports, the screen’s flatness has also improved significantly. The thickness has decreased by 8.6%, and when folded, it decreases by 12.5%. In addition, the hinge width has been reduced by 8%, and the overall hinge area has decreased by 17%, making the device more compact and streamlined.

According to previous reports, the Mix Fold 3 will have an 8.02-inch inner screen and a 6.5-inch outer screen. It is worth mentioning that both screens will support a 120Hz refresh rate.

The device has a rear quad-camera system in a rectangular camera module. The lenses are arranged in a square. The cameras are co-developed with Leica and are rumored to include a 3.2x portrait central focus lens and a 5x periscope telephoto lens.

The Xiaomi Mix Fold 3 will be powered by the Snapdragon 8 Gen 2 chipset. This chipset includes a Cortex-X3 super core clocked at 3.2 GHz, an Adreno 740 GPU, and a Snapdragon X70 5G modem.

The device will be available in two colors: gold and black. It will support 67W wired charging and 50W wireless charging. However, the battery capacity is unknown.

At present, the pricing of this device is still unclear. In the coming days, Xiaomi is expected to reveal more highlights.

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Today, the OnePlus Ace2 Pro (PJA110) was listed on the AnTuTu benchmark, along with some basic specifications, and it also revealed the device’s benchmark scores.

As shown in the image, this device scored 1,733,703 points, including 456,555 CPU points, 613,916 GPU points, 363,631 MEM points, and 299,601 UX points.

The benchmark mentions that the OnePlus Ace2 Pro will be powered by the Snapdragon 8 Gen2 chipset. This chipset includes one Cortex-X3 super core clocked at 3.2 GHz, two Cortex-A715 and two Cortex-A710 performance cores clocked at 2.8 GHz, and three Cortex-A510 efficiency cores clocked at 2.0 GHz. In addition, it has an Adreno 740 GPU.

This device comes with 24GB LPDDR5x RAM and 1TB UFS 4.0 storage. In addition, the device runs Android 13.

According to previous reports, the OnePlus Ace2 Pro is expected to feature a 6.74-inch curved display with 1.5K resolution. In addition, it will have a large 5,000 mAh battery and support 150W fast charging.

The OnePlus Ace2 Pro may have a triple rear camera module, including a 50MP main lens (Sony IMX890), an 8MP ultra-wide-angle lens, and a 2MP macro lens. The front is expected to feature a 16MP selfie camera.

At present, there is no information about the release date of the OnePlus Ace2 Pro. However, we can expect OnePlus to make an announcement in the coming days.

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This morning, Digital Chat Station revealed that a new OPPO phone is in development and will be powered by the Snapdragon 8 Gen 3 chipset.

In addition to the flagship chipset, this smartphone will also feature lenses from Sony’s IMX9 and IMX8 series. The prototype has a 50MP periscope lens (1/1.5±) mounted in a large round lens module. Furthermore, the smartphone also comes with a 2K-resolution micro-curved display manufactured by Samsung, with a single punch-hole in the center of the screen.

The Qualcomm Snapdragon 8 Gen 3 is expected to adopt a new core architecture, including one Cortex-X4 core, five Cortex-A720 cores with different frequencies, and two Cortex-A520 cores.

It is worth noting that Qualcomm has announced that the 2023 Snapdragon Summit will be held from October 24 to 26, during which the Snapdragon 8 Gen 3 is expected to be released. After the launch of this chipset, we can also expect the OPPO Find X7 series to be launched soon.

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At present, there are many rumors about the Mate 40, especially regarding its design. Today, we discovered a new patent from Huawei, which is very likely a design patent for the Mate 40 series.

This patent was submitted by Huawei Technologies Co., Ltd. to the China National Intellectual Property Administration on January 21, 2020, and was approved on August 14, 2020. The main description of the patent is a mobile phone. Its front does not have a front-facing camera hole, which indicates that it uses an under-display camera. The rear camera module includes four cameras and a display.

According to the patent description, it only displays the time. It is speculated that it should be able to display time, calendar, weather, etc. Its camera module has three designs: the display in the middle, the display at the top, and the display at the bottom. It is currently unclear which solution the Mate 40 series will adopt. It is also possible that the Mate 40, Mate 40 Pro, and Mate 40 Pro+ will adopt different solutions.

In addition, there is a volume button and a power button on the right side. We know that there is no volume button on the Mate 30 Pro. It seems that the volume button will reappear on the Mate 40 Pro.

A similar camera has already appeared on the Meizu PRO 7. According to the patent images, the rear display on the Mate 40 series is smaller than that of the Meizu PRO 7. The rear display on the Meizu PRO 7 can show more content, such as photos, messages, time, and calendar.

According to current information, the Huawei Mate 40 will be powered by the Kirin 9000 chipset, with 8GB/12GB of RAM and 128GB/256GB/512GB of storage. It will use an under-display fingerprint sensor. It will come with a non-removable battery, a gravity sensor, a proximity sensor, an optical sensor, an accelerometer, an electronic compass, and a gyroscope.

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This morning, Honor revealed on Weibo that it will launch three additional products at the Honor Magic V2 launch event, including the MagicPad, Watch 4, and Smart TV 5.

Starting with the MagicPad, tablets will also be part of this launch event. However, the official announcement did not reveal much information. Judging from the launch poster, it will feature a 13-inch display with very narrow bezels.

The Honor Watch 4 has a button on the right side. In addition, this watch supports eSIM connectivity and has better battery life than older models.

The size of the Honor Smart TV 5 was not disclosed in the official announcement. However, its appearance looks very high-end and stylishly designed.

As mentioned earlier, the Honor Magic V2 will also be part of this launch event. The device is Honor’s next-generation foldable phone and is expected to feature Qualcomm’s high-end chipset.

It is expected that Honor will reveal more details about its upcoming launch event before July 12.

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Today, a new Huawei device patent has been approved by the China National Intellectual Property Administration. The patent was approved on July 3. The applicant is Huawei Technologies Co., Ltd., and the application date is March 31.

The device disclosed in the patent presents smart glasses, including a body, a camera module, a telescopic module, a rotating module, and a control system.

When shooting or tracking people, the camera can pop out of the chamber and rotate 360 degrees. These movements are driven by telescopic and rotating components.

There are three options in the control application to control the camera’s pop-up, rotation, and rotation direction. Users can choose these options according to their needs.

When the camera is not needed, users can turn off the pop-up camera in the app. The camera will retract into the chamber, so that when the camera component is retracted, users can wear the smart glasses in any scenario.

These smart glasses are not expected to be launched this year. Huawei may launch them in 2021. These glasses will also help Huawei compete with Apple in this field.

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Xiaomi recently filed a new patent for a very special foldable phone, which would allow its front and rear cameras to work simultaneously. The patent was submitted by Beijing Xiaomi Mobile Software Co., Ltd. to the China National Intellectual Property Administration. The patent has been approved and was officially announced on June 23, 2020.

In relevant technologies, smartphones usually have separate front and rear camera modules. The front camera is typically used for selfies and video calls, while the rear camera is usually used for taking photos. However, to meet users’ photography needs, increasing the number of front or rear cameras not only occupies the physical space on the smartphone but also increases hardware costs.

The technical solution provided by the patent can include the following beneficial effects: By setting a gap on the first screen of a foldable phone, when the phone is folded, the cameras on both the second screen and the first screen can be used simultaneously to shoot in the same direction, and multiple functions can be realized without increasing the number of cameras on the foldable phone. Each camera can enhance shooting capability in a single direction, meet users’ shooting needs, save layout space, reduce the difficulty of layout design, lower the hardware cost of the foldable phone, and improve the product’s market competitiveness.

When the camera 13 of the foldable phone is facing the user, the cameras 14 and 15 are also facing the user. At this time, the user can call one or more of cameras 13, 14, and 15 via the foldable mobile phone for self-shooting and video calling, and use cameras 13, 14, and 15 as the front camera at the same time.

When the camera 13 of the foldable phone is facing away from the user, the user can also use one or more of the cameras 13, 14, and 15 for shooting. Camera 15 also serves as the rear camera, enhancing the foldable phone’s rear camera functionality.

When the phone is folded, the gap is also used for the flash to emit light, which can enhance the exposure when taking photos with a foldable phone. Especially in dark places, the flash can instantly increase exposure, making the subject brighter and enhancing the photo effect.

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According to the teardown video, the internal components of the Xiaomi Mi 11 are neatly arranged and very aesthetically pleasing, showcasing the design and craftsmanship of this phone.

There are no other functional components on the back cover, only a large amount of cushioning foam. The main camera glass cover is processed by CNC, while the macro lens uses the cover glass directly, placing higher demands on the optical performance and flatness of the cover and making processing more difficult.

The rear camera of the Xiaomi Mi 11 uses Samsung’s HMX sensor S5K5E9 and OmniVision’s ultra-wide-angle CMOS OV13B10. The front camera is Samsung’s S5K3T2. This phone does not use Sony’s lenses.

The components on the motherboard are all covered with VC heat sinks, and copper foil, graphite, thermal paste, and aerogel are used to ensure the heat dissipation performance. The Snapdragon 888 SoC and flash memory are sealed with glue, which can further enhance their safety when the phone is dropped or exposed to water.

The Xiaomi Mi 11 comes with a BM4X lithium-polymer battery with a capacity of 4600mAh, manufactured by Sunwoda Electronics Co., Ltd.

The video creator also tested the phone’s thermal performance. After playing “PUBG Mobile” for 30 minutes at HDR high-definition 60Hz, the front of the phone reached a maximum temperature of about 41°C, while the back reached about 40°C. When playing “Genshin Impact” at the highest graphics settings for one hour, the maximum temperature reached 37°C. It seems that the Snapdragon 888 generates a lot of heat. If you remove all the cooling materials, such as copper foil and metal shielding, you would find that this SoC can easily reach temperatures above 80°C. It can be said that the Xiaomi Mi 11 performs very well in temperature control.

Currently, the Xiaomi Mi 11 is still on pre-sale and will go on sale on January 1, 2021. It is also the world’s first phone mass-produced with the Snapdragon 888.

Source: Bilibili

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According to the video, the back covers of the Redmi Note 9 4G and Redmi Note 9 5G are made of plastic. The difference is that the back cover of the Redmi Note 9 5G is treated to make it look like AG glass, while the Redmi Note 9 Pro 5G uses a real AG glass back cover.

The Redmi Note 9 4G has a cooling film on the back cover, while the cooling films of the 5G and Pro 5G versions are placed on the body. The back covers of both the 4G and 5G versions have fingerprint flex cables connecting to the motherboard. In addition, their back covers also integrate antennas. The difference is that the back cover of the 5G version has more antennas.

The flash of the Redmi Note 9 4G is integrated into the motherboard cover and connected to the motherboard via metal contact points. The flash of the 5G version is integrated into the camera module cage, while the flash of the Pro 5G is soldered onto the motherboard.

The 3.5mm headphone jack of the Note 9 4G is soldered onto the motherboard, while the other two are integrated into the bottom board. The processor on the motherboard is covered with a metal copper foil and coated with thermal paste. After peeling off the copper foil, the processor and ROM chip are visible.

They are powered by Snapdragon 662, Dimensity 800U, and Snapdragon 750G processors, and their memory and storage use UFS 2.2 and LPDDR4.

Their battery capacities are 6000 mAh, 5000 mAh, and 4820 mAh, respectively. All three phones use the same model of speaker, but the cable designs are different.

Their bottom board integrates a Type-C port, charging protection circuit, antenna, and speaker contacts. The 5G and Pro 5G versions also integrate a 3.5mm headphone jack.

All three phones use LCD screens, and the 4G version’s screen also integrates the cables for the mainboard and sub-board. Their screen models are PM6530MB2-3, PM6675JB3-1, and PM6530JB3-4, all from China Star Optoelectronics Technology Co., Ltd.

In the middle frame of the Redmi Note 9 Pro 5G, a copper tube is added to the Snapdragon 750G.

Source: Bilibili

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According to the picture, due to the larger camera module, the iPhone 12 Pro Max’s motherboard is the same as the iPhone 12 and 12 Pro, and it has moved from the right side of the previous generation to the left side, leaving space for the SIM card slot. It is worth mentioning that the motherboard of the iPhone 12 Pro Max is shorter than that of the iPhone 12 Pro.

The teardown also confirmed that the iPhone 12 Pro Max has a battery capacity of only 3,687 mAh. The L-shaped battery capacity has been reduced compared to the previous generation. The iPhone 11 Pro Max had a capacity of 3,969 mAh.

The teardown did not disclose specific information about the memory, flash memory, modem, or other components.

Source: Weibo

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First, use a screwdriver to remove the two screws at the bottom of the phone, then use a screen opener to pry open the screen and create a small gap. To enhance the phone’s water resistance, Apple uses a lot of adhesive to secure the screen, so it is not possible to use a traditional suction cup to lift the screen. Then insert a pry tool into the gap and slowly lift the screen slightly. Please note that the screen has two cables connected to the motherboard. Do not forcefully open the screen. Otherwise, the cables may be damaged.

Once you turn on the screen, you can see most of its components. Previous reports said that the iPhone 12 mini had a very small battery capacity, leaving many people with doubts when buying it. As we can see from the picture, its battery capacity is only 2,227 mAh, and the battery model is A2471, 3.85V, 8.57 Wh. It seems that users who buy an iPhone 12 mini will have to carry a power bank when they go out to avoid running out of power.

Remove the screws and metal parts from the two cables, then disconnect them from the motherboard.

Then remove all screws securing the motherboard and camera, disconnect the 15 cables from the motherboard, and remove the front camera module and the rear camera module.

The iPhone 12 mini still uses an L-shaped motherboard with a double-layer structure. Unlike other iPhone 12 models, its SIM card base is integrated into the motherboard, making the motherboard more integrated.

As for other components and chip models, the author did not specify in detail.

Source: Weibo

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First, heat the back cover for about 3 minutes, then use a suction cup and a pry tool to remove the back cover. It is worth mentioning that the back cover weighs 40 grams.

The Mate 40 RS still uses a three-stage design. Its middle and lower parts are almost the same as the Mate 40 Pro, only the upper part is different.

Then, remove the screws securing the motherboard cover and peel off the tape at the bottom. This motherboard cover integrates an NFC induction coil, a wireless charging module, and an infrared temperature sensor.

Then remove all screws, disconnect all cables from the motherboard, and remove the camera module and the motherboard.

To install the camera, the middle of the motherboard is completely hollowed out. Then remove the metal shield on the motherboard.

We found the HiSilicon logo on this ROM chip, indicating that it was developed by Huawei. Previously, a blogger tested that the read and write performance of the Huawei Mate 40 Pro can reach about twice the speed of UFS 3.1.

According to reports, the Huawei Mate 40 Pro and above models use HiSilicon’s self-developed SFS 1.0 ROM. Compared with UFS 3.1, the random read and write speeds are almost doubled. Currently, the average sequential read speed of UFS 3.1 is about 1800 MB/s, the sequential write speed is about 700 MB/s, and the random write speed is about 200-300 MB/s.

In the latest Huawei Mate 40 Pro benchmark, we found that the phone has a sequential read speed of 1966 MB/s, a sequential write speed of 1280 MB/s, a random read speed of 383 MB/s, and a random write speed of 548 MB/s. Its random write speed is twice that of UFS 3.1.

SFS is a new type of flash memory developed by Huawei. However, because Huawei rarely mentions this new flash memory technology and has never promoted it at mobile phone conferences, we currently know very little about it.

Source: bilibili

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